Methods for depositing high-K dielectrics

ABSTRACT

Methods for depositing high-K dielectrics are described, including depositing a first electrode on a substrate, wherein the first electrode is chosen from the group consisting of platinum and ruthenium, applying an oxygen plasma treatment to the exposed metal to reduce the contact angle of a surface of the metal, and depositing a titanium oxide layer on the exposed metal using at least one of a chemical vapor deposition process and an atomic layer deposition process, wherein the titanium oxide layer includes at least a portion of rutile titanium oxide.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 13/039,819, filed Mar. 3, 2011, which is acontinuation application of U.S. patent application Ser. No. 12/495,558,filed Jun. 30, 2009, now U.S. Pat. No. 7,927,947, each of which isherein incorporated by reference for all purposes.

This document relates to the subject matter of a joint researchagreement between Intermolecular, Inc. and Elpida Memory, Inc.

FIELD OF THE INVENTION

The present invention relates generally to dielectric materials. Morespecifically, techniques for depositing high-K dielectrics aredescribed.

BACKGROUND OF THE INVENTION

Semiconductor memories (e.g. dynamic random access memory (DRAM)) caninclude memory cells that have a capacitor to store charge. Thecapacitor is typically a metal-insulator-metal (MIM) structure in whichthe insulator stores the charge for the cell. The state of the memorycell can be changed (e.g. from 0 to 1 or 1 to 0) by charging ordischarging the capacitor.

It is desirable to reduce the size of individual memory cells toincrease memory density thereby increasing potential memory storage. Oneway to reduce the size of individual memory cells is to increase thedielectric constant (K) of the insulator materials in the capacitors. Amaterial with a higher dielectric constant can store more charge perunit volume, thereby reducing the amount of material needed to achieve adesired amount of charge.

Several materials have high dielectric constants. For example, titaniumoxide potentially has a dielectric constant of over 90. However,different crystal phases of titanium oxide have different dielectricconstants, and titanium oxide layers often have dielectric constantsmuch lower than is desirable. Thus, what is needed are techniques forincreasing the dielectric constant of deposited layers.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the followingdetailed description and the accompanying drawings:

FIG. 1 is a flowchart illustrating a process for increasing a dielectricconstant of a dielectric layer used for semiconductor memory;

FIG. 2 illustrates a memory cell including a capacitor having ametal-insulator-metal (MIM) structure;

FIGS. 3A-3D illustrate the formation of an MIM capacitor usingtechniques to increase the dielectric constant of an insulating layer;

FIG. 4 is a flowchart describing a process for forming a capacitor;

FIG. 5A illustrates the reduction of the contact angle of a platinumelectrode when subjected to oxygen plasma treatment;

FIG. 5B is a graph that illustrates the growth of ALD layers depositedon platinum;

FIG. 5C is an X-Ray Diffraction (XRD) graph illustrating the depositionof titanium oxide on platinum electrodes using oxygen plasma treatmentsdiscussed herein;

FIG. 6A is an XRD graph showing the crystal orientations of filmsdeposited using certain PVD conditions; and

FIG. 6B is a contour plot showing that the XRD peak height ratio betweenrutile (211) and anatase (211) increases when titanium dioxide isdeposited on a platinum electrode deposited with a higher oxygen (O₂)partial pressure in the working gas and with a higher pedestaltemperature. These conditions also give platinum with a [111]orientation.

DETAILED DESCRIPTION

A detailed description of one or more embodiments is provided belowalong with accompanying figures. The detailed description is provided inconnection with such embodiments, but is not limited to any particularexample. The scope is limited only by the claims and numerousalternatives, modifications, and equivalents are encompassed. Numerousspecific details are set forth in the following description in order toprovide a thorough understanding. These details are provided for thepurpose of example and the described techniques may be practicedaccording to the claims without some or all of these specific details.For the purpose of clarity, technical material that is known in thetechnical fields related to the embodiments has not been described indetail to avoid unnecessarily obscuring the description.

According to various embodiments, techniques for forming high-dielectricconstant (high-K) dielectric layers are described. The dielectric layercan be used as part of a capacitor for a memory cell, for example. Thedielectric layer can be, for example, titanium oxide, which has arelatively higher-K crystal phase (rutile) and a relatively lower-Kcrystal phase (anatase). The techniques described herein can be used todeposit more rutile relative to the amount of anatase that is deposited.Rutile growth can be encouraged by using an oxygen plasma treatment onthe electrode on which the titanium oxide is to be deposited.Additionally, rutile growth can be promoted by varying physical vapordeposition (PVD) parameters for the deposition of an electrode on whichthe titanium oxide is to be deposited. In some embodiments, rutilegrowth can be promoted by depositing titanium oxide on a platinumelectrode and increasing the pedestal temperature and the oxygen partialpressure of the working gas during deposition of the electrode.

I. Memory Cells

A. High-K Dielectrics

A capacitor can be used to store a bit of memory. For example, dynamicrandom access memory (DRAM) cells include a metal-insulator-metal (MIM)capacitor that can have a different value (e.g., 0 or 1) depending onthe amount of charge stored. As DRAM arrays become smaller and smaller,a need has arisen for high-K dielectrics that can be used with DRAMcapacitors. Higher-K materials can store more charge in a smallervolume, and therefore are desirable for reducing memory cell size.

Titanium Oxide (TiO₂) is one high-K material. Titanium oxide can havemultiple crystal phases which have different dielectric constants. Twoknown crystal phases of titanium oxide are anatase and rutile. Anataseis relatively lower-K (K˜40), while rutile has a much higher dielectricconstant (K˜90). It is therefore desirable to promote the formation ofrutile, even in films that may also contain anatase, to increase thedielectric constant of deposited films and therefore the ability to usesmaller features in semiconductor devices.

B. Process for Increasing Dielectric Constant of Deposited Metal Oxides

FIG. 1 is a flowchart illustrating a process 100 for increasing adielectric constant of a dielectric layer used for semiconductor memory.For example, the dielectric layer can be used in a metal-insulator-metal(MIM) capacitor that is part of a semiconductor memory cell such asdynamic random access memory (DRAM) (see e.g. FIG. 2).

In operation 102, a first electrode is deposited on a substrate. Theelectrode can be, for example, noble or near-noble metal such asplatinum or ruthenium. In other embodiments, the electrode can be ametal or compound having a relatively high work function (e.g. greaterthan 5 eV). Such materials are used for semiconductor memories becauseof their advantageous electrical characteristics. For example, platinumhas a high work function (˜5.65 electron volts), which can reduceleakage in capacitors, which in turn reduces the refresh rate of amemory using the capacitors. In some embodiments, PVD process conditionsfor depositing the first electrode can be changed to increase the amountof rutile in a titanium oxide layer deposited on the first electrode.

In operation 104, an oxygen plasma treatment is applied to the firstelectrode to reduce the contact angle of the surface of the electrode.As is explained further in the discussion of FIG. 5A, oxygen plasma canbe use to reduce the contact angle of typically hydrophobic noble metalssuch as platinum, which can therefore be used to increase adsorption ofprecursors used to deposit metal oxides thereon. Additionally, as willbe explained regarding FIG. 5C, the plasma treatment changes the surfaceenergy of the electrode thereby promoting the growth of rutile titaniumoxide on the treated electrode, and increasing the dielectric constantof a titanium oxide layer deposited on the first electrode.

In operation 106, a titanium oxide layer is deposited on the firstelectrode using at least one of chemical vapor deposition (CVD) andatomic layer deposition (ALD). CVD and ALD are vapor-based depositiontechniques that use precursors to react with an oxidant in the gasmixture or on electrode surface to form a layer of material (e.g. atitanium oxide layer). In further operations, a capacitor can be formedby forming an additional electrode over the titanium oxide layer.

C. Memory Cell Structure

FIG. 2 illustrates a memory cell 200 including a capacitor having ametal-insulator-metal (MIM) structure. The memory cell 200 is one ofseveral possible configurations that can be formed utilizing the high-Kdielectrics described herein. The memory cell 200 includes a capacitor202 having an MIM structure, although other layers (e.g., multipleinsulating or metal layers) can be included. For example, the capacitor202 may be a metal-insulator-insulator-metal (MIIM) or ametal-insulator-metal-insulator-metal (MIMIM) structure.

The capacitor 202 includes two conductive electrodes 204 and 206, and aninsulating layer 208 (a dielectric). The electrodes 204 and 206 can benoble, near-noble or non-noble metals (for example platinum orruthenium) that, for example, have a high work function thus promotelower leakage, and the insulating layer 208 is a high-K dielectric suchas titanium oxide or doped titanium oxide. In other embodiments, theelectrodes can be any material that is hydrophobic or that inhibits theformation of oxides thereon. The capacitor 202 is surrounded byinterlayer dielectrics (ILDs) 210 that can be insulating materials suchas silicon dioxide, silicon nitride, or low-K dielectrics. The capacitor202 is shown having a cylinder structure, although other capacitorconfigurations such as pedestal/pillar structures or crown structurescan also be used.

The capacitor is connected to contacts 212 and 214, which can be used toapply voltage across the MIM 202 to maintain charge on the memory cell200 and to change the memory state of the cell 200. The contact 214 isattached to a memory cell transistor 216 which can be used to select thememory cell 200 for read/write access. It is understood that the cell200 is an example of memory cells that could be used with the high-Kdielectrics described herein, and that other structures andconfigurations can also be used.

II. Electrode Processing and High-K Dielectric Deposition

A. Electrode Processing and Device Formation

FIGS. 3A-3D illustrate the formation of an MIM capacitor usingtechniques to increase the dielectric constant of a titanium oxidelayer. FIG. 4 is a flowchart describing a process 400 for forming acapacitor 300.

In operation 402, a substrate 302 is provided. The substrate may be anyappropriate substrate, such as a silicon-based substrate, and mayinclude conductive portions such as interconnects (bit lines, wordlines) or contact plugs such as those shown in FIG. 2. For example, thesubstrate 302 may include interlayer dielectrics 210 and a contact 214.

In operation 404, a first electrode 304 is deposited on the substrate302. The first electrode 304 may be a noble, near-noble, or non-noblematerial, for example platinum or ruthenium, and can be deposited usingany appropriate technique, such as CVD, ALD, or PVD. In someembodiments, (see operation 405), the first electrode 304 can beplatinum deposited using certain PVD processing parameters so that adesired texture of the electrode is achieved (see FIGS. 6A and 6B) toincrease the amount of rutile deposited on the first electrode. In otherembodiments, the first electrode 304 may be any conductive material thatis hydrophobic and inhibits the formation of oxides thereon. FIG. 3Aillustrates the first electrode 304 deposited on the substrate 302. Thefirst electrode 304 may be, for example, the electrode 206 of the memorycell 200.

In operation 405, when the electrode 304 is deposited, the electrode 304can be optionally textured to promote the growth of rutile titaniumoxide insulator on the electrode 304. Rutile titanium oxide is desirablebecause it has a high dielectric constant (K˜90) relative to the anatasecrystal phase of titanium oxide (K˜40). It can also be desirable toincrease the proportion of rutile titanium oxide compared to anatase.

Rutile has a tetragonal crystal structure whose growth can be encouragedby using vapor-based deposition techniques (e.g. ALD, CVD) to deposittitanium oxide on electrodes having similar crystal structures orsimilar lattice parameters at their interface. As is described in moredetail in the discussion regarding FIGS. 6A and 6B, a platinum electrodehaving a [111] orientation may provide a good template for rutiletitanium oxide. In some embodiments, the [111] platinum orientation canbe encouraged by varying certain PVD processing parameters, such asworking gas mixture and pedestal temperature. For example, in order todeposit platinum having a [111] orientation, a deposition process usinga working gas mixture having an oxygen partial pressure of greater than10 percent at pedestal temperature of 300° C. can be used.

In operation 406, the first electrode 304 is treated using an oxygenplasma treatment 306, which is shown in FIG. 3B. The plasma treatment306 can be applied using a plasma applicator 308 such as a high-vacuumplasma system or an atmospheric plasma application. Any type of plasmatreatment can be used to improve ALD or CVD nucleation. For example,samples were prepared using both high-density radio frequency (RF)-basedplasma (using a preclean chamber of a PVD tool) and atmospheric plasmas(using a handheld plasma application tool). The high-density plasmacould be formed from oxygen or oxygen and another gas, with powers from500 W to 10 kW, and pressures from 10-15 mTorr, for example. These twoplasma applications span the range from high-quality to low-qualityapplications, but still produce high-K metal oxide layers. Thisindicates that the important quality of the plasma is that the oxygenradical species change the nature of the surface of the electrode andchange the surface energy regardless of the method of plasmaapplication. It is believed that this modification promotes the growthof rutile titanium oxide.

In operation 408, a titanium oxide layer 310 is deposited over the firstelectrode 304, which is shown in FIG. 3C. The titanium oxide layer 310can also be doped with another insulating layer, for example to form ayttrium doped titanium oxide layer or an aluminum doped titanium oxidelayer. In some examples, yttrium oxide concentrations can be from 1-5atomic percent and aluminum oxide concentrations can be from 1-20 atomicpercent.

The titanium oxide layer 310 can be deposited using either CVD or ALD,and can be deposited from precursors such as Titanium Tetraisopropoxide(TTIP), Tetrakis Dimethylamino Titanium (TDMAT), Tetrakis DiethylamidoTitanium (TDEAT), or tetrakis-ethylmethyl-amido titanium (TEMAT). WithALD depositions, the oxidizing reagent can be ozone, water vapor, oroxygen. The thickness of the layer can be any desired thickness, forexample from 10-1000 Å.

The plasma treatment of the first electrode 304 helps to promote thegrowth of rutile titanium oxide, which has higher dielectric constantthan anatase. The plasma treatment promotes the deposition of a smootheroxide layer. It is also believed that the plasma treatment changes thesurface energy of the electrode 304, which encourages the growth ofrutile. As is described in the discussion regarding FIG. 5C, the oxygenplasma treatment can help suppress the formation of anatase and promotethe formation of rutile.

In operation 410, a second electrode 312 (e.g. the electrode 204) isdeposited, and the capacitor formation is completed. After the secondelectrode is deposited, other layers, such as the contact 212 can bedeposited thereon. FIG. 3D illustrates the completed capacitor 300.

In some embodiments, the titanium oxide layer can be thermally treated,for example by annealing, either before or after the second electrode312 is deposited. For example, the titanium oxide layer can be annealedusing a rapid thermal oxidation (RTO) of approximately 600° C. orgreater. The thermal treatment, it is believed, can cause or enhance theformation of rutile in the titanium oxide layer.

B. Experimental and Sample Data

FIG. 5A illustrates the reduction of the contact angle of a platinumelectrode when subjected to oxygen plasma treatment. As shown in thegraph 500, the platinum substrate as deposited, before treatment 502,has a contact angle of at least 50°, indicating a hydrophobic surfacethat may inhibit ALD nucleation. After a one hour oxygen plasmatreatment 504, the contact angle drops to approximately 0°, indicatingan extremely hydrophilic surface that promotes ALD nucleation. Threehours following the completion of the treatment, although the contactangle increases 506, it is still lower than that as deposited Pt, whichcan, for ALD process, significantly reduce nucleation delay (see FIG.5B).

Rapid thermal oxidation (RTO) is another treatment that can be used tolower the contact angle of electrodes. For example, a bare platinumelectrode surface was optimized post RTO at 700° C. for ten minutes 508,lowering the contact angle to below 20°. However, the plasma treatment504 reduces the contact angle much further, and therefore betterpromotes nucleation of ALD precursors.

As-deposited platinum and other noble metals hinder ALD nucleation,which can lead to a nucleation delay. FIG. 5B is a graph thatillustrates the growth of ALD layers deposited on platinum. The graph520 plots thickness as a function of a number of ALD cycles. A plot 522illustrates the theoretical growth of a metal oxide layer deposited onplatinum that has been treated using oxygen plasma, and a plot 524illustrates the theoretical growth of a metal oxide layer deposited onplatinum that has not been so treated. The nucleation delay 526 of theplot 522 and the nucleation delay 528 of the plot 524 are periods oftime over which layer growth is retarded because of poor nucleation onthe platinum surface. Typically, the first cycles of deposition foruntreated platinum or ruthenium substrates can suffer from the reductionin deposition rate as precursors may not adsorb to the platinum surfaceas readily as they do to already deposited layers of metal oxide sincethe already-deposited layers are more receptive to ALD nucleation.

As can be seen, in theory the nucleation delay 526 is much shorter thanthe nucleation delay 528, illustrating another potential benefit of theoxygen plasma treatment. Additionally, since in theory fewer cycles arerequired to deposit the layer, less precursor is used, which reduceswaste and therefore costs. In some embodiments, the nucleation delay 526can be eliminated or almost eliminated.

FIG. 5C is an X-Ray Diffraction (XRD) graph 540 illustrating thetitanium oxide layer deposited on platinum electrode using oxygen plasmatreatments discussed herein. XRD can be used to determine the existenceof different crystal phases in a sample. Each crystallized structure hasits signature X-ray diffraction angles—for example, platinum crystalshows a peak at approximately 67.5° for its (220) planes' diffraction ifcopper is used as the X-ray source.

Plots 542 and 546 represent titanium oxide layers deposited on oxygenplasma treated platinum bottom electrodes. The titanium oxide layerswere deposited using ALD with a titanium tetraisopropoxide (TTIP)precursor. The plot 542 represents a sample that has been thermallytreated (using rapid thermal anneal with O₂ (RTO)) at 700° C. for 10minutes after the deposition of the titanium oxide layer, and plot 546represents a sample that has not been thermally treated. Plots 544 and548 represent samples that were deposited without treating the platinumelectrode; plot 544 represents a sample that was thermally oxidized, andplot 548 represents a sample that was not thermally oxidized.

The plasma-treated samples 542 and 546 and the thermally oxidized butuntreated sample 544 show rutile (211) peaks 550 at 54.3°. The rutilepeak from plasma-treated sample 542 is stronger than the rutile peakfrom untreated sample 544. The untreated sample 548 shows no rutilepeak, and shows an anatase (105) peak 552 at 53.9°. Therefore, theplasma treatment of the platinum appears to increase the amount ofrutile in the titanium oxide layer.

All samples show anatase (101) peaks 554 at 25.3°, the intensity whichincreases with thermal oxidation and which is unaffected by plasmatreatment. Additionally, anatase (200) peaks 556 at 48.1° are present inthe thermally oxidized samples 542 and 544, but are unaffected by plasmatreatment. Other peaks shown in FIG. 5C include platinum (111) peaks 560at 39.8°, platinum (200) peaks 562 at 46.2°, and platinum (220) peaks564 at 67.5°.

Plasma treatment of platinum electrodes thereby promotes the growth ofrutile titanium dioxide. Samples that were formed without plasmatreatment showed substantially no rutile formation. Additionally, thedielectric constant of the titanium dioxide layer may increase fromapproximately 40 to 50-60. Additionally, although data for platinum isshown here, oxygen plasma treatment should encourage the growth ofrutile on other noble, near-noble, or non-noble electrodes such asruthenium.

III. Electrode Texturing

Depositing titanium oxide on untreated platinum typically results in thedeposition of relatively low-K anatase. Described below are techniquesfor promoting the deposition of rutile by altering process conditionsfor PVD platinum deposition to change the texture (crystal orientation)of the platinum electrode. Depositing a textured platinum electrodehaving lattice parameters in the surface plane that match the latticeparameters of rutile titanium oxide can promote the growth of rutiletitanium oxide and increase the K-value of the deposited dielectric. Inthis way, the platinum electrode can be used as a template. A platinumelectrode having strong [111] crystal orientation can be used as atemplate for rutile deposition. As is described further below, the [111]orientation can be encouraged by using a high pedestal temperature (i.e.greater than 250° C.) and a working gas with a high oxygen partialpressure (e.g. greater than 10 percent). The working gas can include,for example, argon (or another inert gas) and oxygen.

FIG. 6A is an XRD graph showing the crystal orientations of filmsdeposited using certain PVD conditions. FIG. 6B is a contour plotshowing that the proportion of rutile to anatase increases when titaniumoxide is deposited on an electrode that was deposited using PVD with ahigher oxygen (O₂) partial pressure in the working gas and with a higherpedestal temperature. These conditions also give platinum with a [111]orientation. In addition, texturing can be combined with plasmatreatments, described above, to further increase the film's dielectricconstant.

Various parameters of the PVD deposition of platinum can be used totexture the electrode: changing the pedestal temperature and changingthe mixture of the working gas have been shown to affect platinumtexture. The plots 602-606 of FIG. 6A show the XRD plots of platinumelectrodes deposited using varying conditions. The plot 602 represents aplatinum sample deposited at high pedestal temperature (250-300° C., forexample) in an argon/oxygen working gas mixture. The plot 604 representsa platinum sample deposited with a pedestal temperature of approximately20° C. and an argon/oxygen working gas. The plot 606 represents aplatinum sample that is deposited using a high pedestal temperature(250-300° C.) and a working gas having a high oxygen partial pressure,for example greater than 10%. Sputtering power was also investigated asa variable for altering the platinum texture, but was shown to have aminor effect on texture. The plots 602 and 604 were deposited at 50watts of power.

The [220] orientation is indicated by the peaks 608 at 67.5°, the [200]orientation is indicated by the peaks at 46.2°, and the [111]orientation of platinum is indicated by the peaks 612 at 39.8°. Highoxygen partial pressure and high pedestal temperature (e.g., greaterthan 10% and greater than 250° C.) encourage formation of the [111]orientation as indicated by the peaks 612. The sample represented by theplot 606 has a strong (111) peak and a weak (220) peak, versus thesample represented by the plot 604, which has both a strong (220) peakand a strong (111) peak. The sample represented by the plot 606therefore has a higher proportion of [111] platinum. When titanium oxidewas deposited on the samples represented by the plots 604 and 606, usingTTIP and ozone as ALD reagents, and using a 600° C. RTO, a rutile (211)peak was found on the sample represented by the plot 606. Therefore,rutile [211] has been shown to form on platinum deposited using PVD withoxygen partial pressures exceeding 10% and pedestal temperaturesexceeding 250° C. Further, as is shown in FIG. 6B, rutile is more likelyto form under these conditions.

FIG. 6B is a contour plot 650 showing the XRD peak ratio between rutile(211) and anatase (211) in a sample as a function of PVD working gasoxygen partial pressure and pedestal temperature. The section 652corresponds to higher deposition temperatures and higher oxygen partialpressures that result in a rutile (211) to anatase (211) ratio ofgreater than 0.875. Therefore, increasing the pedestal temperature andincreasing the oxygen partial pressure of the working gas have beenshown to increase the amount of rutile deposited. For example, apedestal temperature of greater than 200° C. and an oxygen partialpressure of more than 10% can produce desirable amounts of rutile.Alternatively, higher temperatures (e.g., 250° C., or 300° C.) or higheroxygen partial pressures (e.g. 15%, 20%, 30%, 40% or greater) increasethe likelihood of the deposition of rutile on the platinum electrode.

In some embodiments, for example, the pedestal temperature can begreater than 200° C., greater than 250° C., greater than 300° C.,between 200 and 300° C., between 250 and 300° C., between 250 and 400°C., etc. In some embodiments, for example, the working gas for the PVDprocess can include oxygen (e.g. can be an argon/oxygen mixture), andthe oxygen partial pressure can be greater than 10%, greater than 15%,greater than 20%, greater than 30%, greater than 40%, between 10% and20%, between 10% and 15%, between 15% and 20%, between 15% and 30%, etc.

Although the foregoing examples have been described in some detail forpurposes of clarity of understanding, the invention is not limited tothe details provided. There are many alternative ways of implementingthe invention. The disclosed examples are illustrative and notrestrictive.

What is claimed:
 1. A film stack comprising: a first electrode formed ona substrate, wherein the first electrode is chosen from the groupconsisting of platinum and ruthenium, wherein an oxygen plasma treatmentis applied to an exposed first electrode to reduce a contact angle of asurface of the first electrode; a titanium oxide layer formed on theexposed first electrode using at least one of a chemical vapordeposition process or an atomic layer deposition process, wherein thetitanium oxide layer comprises at least a portion of rutile titaniumoxide; and wherein the film stack is annealed using a rapid thermaloxidation (RTO) process of at least approximately 600° C.
 2. The filmstack of claim 1, wherein applying the oxygen plasma treatment comprisesusing one of a high density plasma or an atmospheric plasma.
 3. The filmstack of claim 1, wherein the titanium oxide layer has an X-RayDiffraction peak associated with rutile titanium oxide.
 4. The filmstack of claim 1, wherein the first electrode comprises platinumdeposited using physical vapor deposition (PVD) with a pedestaltemperature greater than 250° Celsius.
 5. The film stack of claim 4,further comprising depositing the first electrode using PVD with aworking gas having an oxygen partial pressure of greater than 10percent.
 6. The film stack of claim 1, wherein depositing the firstelectrode comprises depositing a platinum electrode having a [111]crystal orientation.
 7. The film stack of claim 1, further comprising asecond electrode deposited over the titanium oxide layer to form acapacitor.
 8. A film stack comprising: a platinum electrode deposited ona substrate using physical vapor deposition (PVD) with a pedestaltemperature of greater than 250° C. and a working gas having an oxygenpartial pressure of greater than 10 percent, wherein the electrode istreated using an oxygen plasma; a titanium oxide layer deposited on theplatinum electrode, wherein the titanium oxide layer is at least aportion rutile titanium oxide; and wherein the titanium oxide layer isdoped with at least one of yttrium oxide or aluminum oxide.
 9. The filmstack of claim 8, further comprising annealing the film stack using arapid thermal oxidation (RTO) process of at least approximately 600° C.10. The film stack of claim 8, further comprising: a second electrodedeposited over the metal oxide layer, wherein the second electrode isone of platinum or ruthenium to form a capacitor structure.
 11. The filmstack of claim 8, wherein the treating comprises using one of a highdensity plasma and an atmospheric plasma.
 12. The film stack of claim 8,wherein the titanium oxide layer includes an X-ray diffraction peakassociated with rutile titanium oxide.
 13. The film stack of claim 8,wherein the pedestal temperature is between 250° and 300° C.
 14. Thefilm stack of claim 8, wherein the pedestal temperature is approximately300° C.
 15. The film stack of claim 8, wherein the oxygen partialpressure is greater than 20 percent.
 16. A film stack comprising: aplatinum electrode deposited on a substrate using physical vapordeposition (PVD) with a pedestal temperature of greater than 250° C. anda working gas having an oxygen partial pressure of greater than 10percent, wherein the electrode is treated using an oxygen plasma; and atitanium oxide layer deposited on the platinum electrode, wherein thetitanium oxide layer is at least a portion rutile titanium oxide; andwherein the film stack is annealed using a rapid thermal oxidation (RTO)process of at least approximately 600° C.
 17. The film stack of claim16, wherein the treating comprises using one of a high density plasmaand an atmospheric plasma.
 18. The film stack of claim 16, wherein thetitanium oxide layer includes an X-ray diffraction peak associated withrutile titanium oxide.